PFA (Perfluoroalkoxy)

Description

PFA (Perfluoroalkoxy polymer) per ASTM D3307 / ISO 12086 is a copolymer of TFE and PAVE that retains virtually all of PTFE chemical resistance while being melt-processable by injection moulding and extrusion. Service temperature -200 to +260 C. Ultra-high purity grades (semi-grade PFA) for semiconductor wet benches, wafer carriers and chemical distribution systems. Lowest extractable contamination of any thermoplastic.

Key Properties — Standard PFA (moulded/extruded)

Rm (Tensile Strength)

25 – 38

MPa

Re / Rp0.2 (Yield)

15 – 25

MPa

A₅ (Elongation)

≥ 250.0

E (Young's Modulus)

GPa

Density

2.15

g/cm³

Main Designations (13)

Standard Body	Designation	Country / Region	Note
ASTM	D3307 (PFA)	USA
ISO	ISO 12086 (PFA)	International
Trade Names	Teflon PFA (Chemours/DuPont) / Hyflon PFA (Solvay) / Neoflon PFA (Daikin)	Global
Semi Grade	Ultra-high-purity PFA for semiconductor (SEMI F57 / SEMI F45)	International
UL	94 V-0 (inherent)	USA
FDA	21 CFR 177.1550 (food contact)	USA
JUS	PL-PFA	Yugoslavia	Perfluoroalkoksi fluoropolimer
RoHS	Compliant	EU
Supply Forms	Tube, pipe, fitting, rod, sheet, film + injection/extrusion compound	Global
ASTM D3307	PFA (resin standard)	USA
ISO	ISO 13000 (fluoropolymer group)	International
Key Grades	PFA HP (high purity semiconductor) / PFA standard / PFA antistatic	Global
NSF	NSF 51 / NSF 61	USA

Standards (13)

#	Standard Body	Designation	Country / Region	Note
1	ASTM	D3307 (PFA)	USA	—
2	ISO	ISO 12086 (PFA)	International	—
3	Trade Names	Teflon PFA (Chemours/DuPont) / Hyflon PFA (Solvay) / Neoflon PFA (Daikin)	Global	—
4	Semi Grade	Ultra-high-purity PFA for semiconductor (SEMI F57 / SEMI F45)	International	—
5	UL	94 V-0 (inherent)	USA	—
6	FDA	21 CFR 177.1550 (food contact)	USA	—
7	JUS	PL-PFA	Yugoslavia	Perfluoroalkoksi fluoropolimer
8	RoHS	Compliant	EU	—
9	Supply Forms	Tube, pipe, fitting, rod, sheet, film + injection/extrusion compound	Global	—
10	ASTM D3307	PFA (resin standard)	USA	—
11	ISO	ISO 13000 (fluoropolymer group)	International	—
12	Key Grades	PFA HP (high purity semiconductor) / PFA standard / PFA antistatic	Global	—
13	NSF	NSF 51 / NSF 61	USA	—

All values in wt.%

Carbon (TFE+PAVE copolymer)

~28.9000

Fluorine

~71.1000

H2O

Water absorption (any)

≤ 0.0300

Element	Symbol	Min %	Max %	Typical %
Carbon (TFE+PAVE copolymer)	C	—	—	28.9000
Fluorine	F	—	—	71.1000
Water absorption (any)	H2O	—	0.0300	—

Mechanical Properties

Condition	Code	Rm min MPa	Rm max MPa	Re min MPa	Re max MPa	A₅ min %	Z %	KV J	HB min	HB max	HRC min	HRC max	E GPa
Standard PFA (moulded/extruded)	STD	25	38	15	25	250.0	—	—	—	—	—	—	0.7

Physical Properties

Density

2.150

g/cm³

Melting Point

300–310

°C

Young's Modulus

0.7

GPa

Poisson's Ratio

0.460

—

Thermal Conductivity

0.2

W/m·K

Thermal Expansion

130.00

×10⁻⁶ /K

Specific Heat

1,000

J/kg·K

Magnetic

Heat Treatment

Service Temperature Limits

Temperature:-200°C – 260°C

Medium:Continuous service

Duration:Indefinite

Cooling:N/A

Hardness After:Full properties

-200 C cryogenic to +260 C continuous — same as PTFE. Above 380 C thermal decomposition (toxic HF gas).

No heat treatment

Medium:N/A

Duration:N/A

Cooling:N/A

Hardness After:N/A

PFA is thermoplastic. Process at 350-380 C (higher than PTFE sintering T). No post-processing required.

Machinability

Machinability Rating

relative to AISI B1112 = 100%

160.0%

Good

Turning Speed (HSS)

500

m/min

Turning Speed (Carbide)

1,800

m/min

Feed Rate (Turning)

0.700

mm/rev

Drilling Speed (HSS)

450

m/min

Milling Speed (Carbide)

1,800

m/min

Coolant	Dry or light compressed air; no flood coolant for precision parts
Chip Formation	Long stringy chips; creep under tool (but stiffer than PTFE)
Tool Material	Sharp carbide K10; VERY sharp HSS acceptable; positive rake essential
Surface Finish	Ra 0.4-3.2 um

Easier to machine than PTFE due to higher strength and creep resistance. Still requires sharp tools and low feed.

Applications

Semiconductor

Wet bench components, chemical distribution piping, wafer carriers, trays and acid containers for semiconductor fabrication.

Chemical Lab

Ultra-pure chemical containers, sampling equipment and analytical instrument wetted parts.

Pharmaceutical

Ultra-pure process piping, fittings and tank liners for pharmaceutical manufacturing.

Chemical Plant

High-temperature chemical piping and vessel lining where PTFE cannot be melt-processed.

Semiconductor

Wet process equipment for HF, H2SO4 and mixed acid semiconductor wafer cleaning.

Pharmaceutical

Process tubing, fittings and gaskets for ultra-pure pharmaceutical process streams.

Chemical

Complex fittings, valve bodies and injection-moulded components in aggressive chemicals.

Food

High-purity food and beverage contact components requiring smooth surfaces.

Technical Notes

💧

Chemical Resistance

Virtually identical to PTFE. Resists all common acids, bases, solvents and oxidising media. NOT resistant to: elemental fluorine, alkali metals, and certain reactive fluorinating agents.

✅

PFA vs PTFE

PFA: injection mouldable (PTFE cannot be), better mechanical properties, slightly higher cost, same chemical/temperature resistance. Use PFA when melt-processing is needed; PTFE for compression-moulded seals and gaskets.

✅

Semiconductor Ultra-Pure

Semi-grade PFA (e.g. Teflon PFA 350-HP) has extractables <ppb level — critical for maintaining wafer cleanliness in wet etch, clean and strip processes. Leachables from non-semi-grade PFA contaminate wafers.

✅

PFA vs PTFE

PTFE: lower cost, wider chemical resistance, compression moulded only. PFA: injection mouldable (complex shapes), 3x better creep, same chemical resistance, higher cost. Use PFA for complex moulded parts; PTFE for flat gaskets and simple shapes.

✅

Semiconductor HP grade

PFA HP (high purity) for semiconductor: ultra-low extractables, no additives, validated for HF handling. Standard PFA for chemical plant. Always specify HP grade for semiconductor wet process applications.